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High-Reliability PCB The standard ENIG (Gold Plating) process consists of the following steps:
Degreasing ↙ Micro-etching ↙ Post-etch rinse ↙ Pre-immersion ↙ Activation ↙ Post-activation rinse ↙ Electroless Nickel Plating ↙ Immersion Gold Plating ↙ Rinsing
Why ENIG Dominates High-End PCB Finishes? 3 Core Advantages Explained
每 Uniform Plating & Excellent Coplanarity
ENIG provides a flat, even surface with consistent nickel (3每5米m) and gold (0.05每0.15米m) layers, ensuring superior solderability, corrosion resistance, and wear resistance.
It is widely used in high-reliability electronics such as 5G modules, RF PCBs, and medical device control boards.
每 Reliable Nickel Barrier Layer
The nickel layer acts as a barrier to prevent diffusion between copper and gold, ensuring robust solder joints for BGA and CSP assembly.
每 Excellent Surface Protection
The immersion gold layer protects the nickel from oxidation, making it ideal for long-term storage and applications in automotive electronics (e.g., ADAS, BMS) and industrial automation PCBA.
Chemical Precision: The Science Behind ENIG＊s Tri-Layer Structure
(1) Activation
A thin, uniform layer of palladium (Pd) is deposited on the copper surface via displacement, providing catalytic activity to initiate the electroless nickel process.
(2) Electroless Nickel Plating
Under palladium catalysis, nickel ions are reduced by sodium hypophosphite, forming a Ni-P alloy layer (9每11% phosphorus), critical for high-density PCB layouts and multilayer PCB designs.
(3) Immersion Gold Plating
Gold is deposited via redox displacement, ensuring low signal loss for high-speed circuits and IoT control boards.
Lattice structure
Nickel Lattice Comparison for Varying Gold Trough Treatment Times
Nickel Lattice Comparison for Varying Gold Trough Treatment Times
Layer-by-Layer Excellence: Functional Synergy in ENIG
每 Palladium (Pd): Initiates electroless nickel deposition for high-precision soldering.
每 Nickel (Ni): A Ni-P alloy base layer providing mechanical strength and thermal cycling resistance.
每 Gold (Au): Oxidation-resistant surface for high-frequency PCB applications and smart sensor integration.
每 Outstanding solderability for SMT assembly and fine-pitch components.
每 Low failure rate PCBA with EMC/EMI compliance, ideal for telecommunication PCBs and wearable electronics.
每 Zero defect PCBA assembly certified to RoHS, UL, and ISO 9001 standards.
每 Controlled impedance design for 5G antennas and optical communication modules.